Recently, the country released two new semiconductor standards, which are expected to be implemented later in 2024. According to the Announcement No. 6 of 2024 issued by the State Administration for Market Regulation (National Standards Administration), the two national standards "Large Scale Integrated Circuit (LSI)-Packaging-Printed Circuit Board Common Design Structure" and "Integrated Circuit Packaging Equipment Remote Operation and Maintenance Status Monitoring" were officially released, which were implemented on August 1 and November 1 respectively.
The body of the announcement has been publicly released, which mentions that remote operation and maintenance is the main means to ensure the reliable operation of integrated circuit packaging equipment, improve the efficiency of equipment and extend the service life of equipment, and can realize data collection, status detection, fault identification and diagnosis, and predictive maintenance of integrated circuit packaging equipment and production process. The purpose of compiling this document is to unify the relevant requirements of the operation and maintenance status monitoring process of integrated circuit packaging equipment, so that the users of the document have a basis to rely on, so as to achieve more accurate maintenance and management of integrated circuit packaging equipment, promote the more effective play of equipment functions, and improve application efficiency. This standard is applicable to the operation status monitoring of the remote operation and maintenance of typical integrated circuit packaging equipment such as mechanical punching machines, screen printing machines, grinding wheel dicing machines, chip placement machines, wire bonding machines, etc., and the remote operation and maintenance status monitoring of electronic component production line equipment is also used as a reference.
This standard provides unified format and rule requirements for the design of LSIs, package substrates and packages, and provides unified principles for the exchange and processing of design data and the sharing of information and results among relevant parties. The release of this standard will play an important supporting role in the improvement of the independent design, manufacturing and testing level of integrated circuits in China.
Figure: Two national standards for integrated circuits were officially released
By formulating and implementing a series of semiconductor technology and product standards, China can promote the standardization and development of the domestic semiconductor industry and improve the overall competitiveness of the industry. At the same time, it will also help promote the exchange and cooperation of the semiconductor industry at home and abroad, attract more international enterprises and talents to participate in the development of China's semiconductor industry, and jointly build an open, cooperative and win-win semiconductor industry ecosystem.
In addition, the development of China's semiconductor industry is also facing the challenges of the whole industry chain from the underlying design technology to the raw materials, equipment, processes, and talents required for manufacturing, and then to the product market. Under such circumstances, China needs to base itself on the global semiconductor industry ecology and promote the development of the semiconductor industry with more systematic and strategic policy ideas. This includes formulating a long-term semiconductor development strategy, accelerating substantive breakthroughs in the global semiconductor supply chain, promoting the diversified reconstruction of the supply chain, and strengthening the top-level planning of the domestic semiconductor industry layout.
The release and implementation of these two standards not only provide unified design and production specifications for China's semiconductor industry, but also promote the digital transformation and intelligent upgrading of the semiconductor industry. By unifying design rules, improving design efficiency, reducing costs, and improving equipment operation and maintenance efficiency, it will help China build a unique, efficient and reliable semiconductor ecosystem and enhance China's competitive position in the global semiconductor industry.
