It has been reported that DreamBig is working with Samsung Foundry to bring innovative chip hub technology and network IO chips to market to create a MARS chip platform. The collaboration leverages Samsung Foundry's leading technology and strong ecosystem in SF4X FinFET process, 3D chip-stacking advanced packaging technology, and HBM memory.
DreamBig is the original pioneer of 3D HBM stacking technology, which is committed to improving the performance and efficiency of memory-intensive systems with its innovative Chiplet Hub, especially in applications such as AI inference and training. The 3D integrated HBM is stacked on the chip hub to form a composable memory hierarchy that includes SRAM, HBM, chip-attached DDR memory, chip-attached CXL memory expansion, and chip-attached PCIe SSD storage. The Chip Hub memory architecture further accelerates memory access efficiency by integrating a highly differentiated, fully correlated hardware-managed Final Level Cache in collaboration with FLC Technology Group.
Creating a new situation for AI chips, DreamBig promotes the transformation of the AI industry
Sohail Syed, Co-Founder and CEO of DreamBig, said: "DreamBig is disrupting the industry by providing leading open silicon integration solutions. The differentiated technologies in the Chiplet Hub™ address the most demanding AI, data center, edge computing, storage, and automotive applications. The chip hub base chip, based on Samsung's Foundry SF4X process and 3D manufacturing technology, provides the best performance and low latency while achieving the low power consumption required for 3D HBM integration, which is difficult to break through in the industry. ”
Sohail Syed added, "DreamBig's MARS chip platform combines chiplet hubs™, 3D HBMs, network IO chips, customer AI processor/accelerator chips, and advanced packaging technologies in silicon boxes to provide customers with unmatched solutions at scale that enable them to achieve the highest performance and energy efficiency at the lowest cost and fastest time to market."
Figure: DreamBig partner with Semiconductor
Samsung Foundry and DreamBig Collaborate to Advance Chip Integration Innovation
Mijung Noh, Vice President of Samsung Electronics' Foundry Business Unit and Head of Business Development Team 1 at Foundry, said, "Next-generation AI applications and chip-based system design are converging, and DreamBig's MARS chip platform is ready to provide customers with chip-integration solutions that integrate 3D HBM. He added, "We are excited to partner with DreamBig to combine our SF4X process technology to provide comprehensive design support for chip integration architectures." The collaboration leverages Samsung's optimized solutions in silicon technology, memory technology, and advanced packaging technology. ”
According to the agreement, Samsung Semiconductor will provide DreamBig Semiconductor with a full range of foundry services, including chip design, manufacturing, packaging and testing. In the chip design phase, Samsung Foundry will use its rich design experience and advanced EDA tools to assist DreamBig Semiconductor in optimizing the chip architecture and circuit design to improve the performance and reliability of the chip. In the manufacturing process, Samsung Foundry will use its most advanced process technology, such as 5nm, 7nm, etc., to produce high-quality, high-performance chip products for DreamBig Semiconductor. At the same time, Samsung Foundry will also provide strong support in packaging and testing to ensure the packaging quality and testing accuracy of products, and escort DreamBig Semiconductor's products to the market.
The partnership will promote innovation in the industry. Through its partnership with Samsung Foundry, DreamBig Semiconductor is able to turn innovative technologies into real-world products faster, bringing more competitive semiconductor solutions to the market. This will stimulate more enterprises to increase R&D investment and promote technological innovation and industrial upgrading of the entire industry.
