In the semiconductor industry, Moore's Law was once the central law driving technological progress. However, as transistor sizes approach their physical limits and costs no longer fall, the traditional foundry model is challenged. In this context, NHanced Semiconductors has proposed the "Foundry 2.0" model, which aims to open up a new path for semiconductor development through advanced packaging technologies and heterogeneous integration.
Foundry 2.0: The Shift from Scale to Customization
The traditional foundry 1.0 model emphasizes high-volume production and is suitable for standardized, high-demand chip manufacturing. However, this model is not strong in the face of diverse, low-volume demand. Foundry 2.0 enables a highly customized production approach by introducing advanced packaging technologies such as 3D packaging, 2.5D packaging, and chiplet design. This model not only reduces development costs, but also shortens the time to market, making it particularly suitable for start-ups, research institutes, and specific application areas.
Chiplet technology: the key to modular design
Chiplet technology splits complex system functions into multiple functional modules, each of which can be designed and manufactured independently, and then integrated together through advanced packaging techniques. This modular design not only increases design flexibility, but also significantly reduces non-recurring engineering costs. According to NHanced Semiconductors, the adoption of chiplet technology can reduce non-recurring engineering costs by about 100 times compared to leading-edge semiconductor nodes.
Figure: Foundry 2.0 technology
Direct Bond Interconnect (DBI): Enables high-performance integration
DBI technology is a low-temperature hybrid bonding method that permanently bonds the surfaces of two wafers, chips, or chiplets together. This technology offers low capacitance, good sealing, and rich interconnect bandwidth to help reduce power consumption, increase speed, and make it suitable for applications in extreme environments. NHanced Semiconductors has made extensive use of DBI technology in its advanced packaging processes to improve the performance and reliability of its products.
The practice and layout of NHanced Semiconductors
NHanced Semiconductors is the first pure-play foundry in the U.S. to focus on advanced packaging, and is committed to promoting the Foundry 2.0 model. The company has established a state-of-the-art package assembly facility in Oden, Indiana, equipped with state-of-the-art cleanrooms and production equipment to support customized production from small to medium batches. In addition, the company has an R&D and manufacturing facility in Morrisville, North Carolina, with a focus on low-volume manufacturing, in-house process development, and customer prototyping.
Conclusion
With the development of the semiconductor industry, traditional manufacturing models have been unable to meet the increasingly diverse market demand. Foundry 2.0 offers a new direction for the semiconductor industry through advanced packaging technology and modular design. As a pioneer in this model, NHanced Semiconductors is promoting the transformation and upgrading of the industry through practical actions.
