Hitachi High-Tech today announced the launch of its new DCR etching system, the 9060 Series. The new system, which combines Hitachi High-Tech's deep expertise in plasma etching technology, is designed for the manufacture of advanced semiconductor devices, especially in the production of semiconductor chips with three-dimensional structures and high aspect ratios, enabling greater precision and efficiency.
The 9060 series etching systems will help customers address the increasingly complex semiconductor manufacturing processes while addressing the many challenges encountered from R&D to volume production. As the semiconductor industry moves toward higher performance, smaller size, and higher levels of integration, the 9060 Series will support the manufacturing of next-generation memory devices, processors, and other high-precision chips.
Product development background: Responding to the miniaturization and complexity of semiconductor equipment
Over the past few decades, the size of semiconductor devices has been shrinking, and the processing technology of integrated circuits has advanced to the nanometer level. As the size shrinks, so do the technical requirements for manufacturing these devices. Especially after the advent of three-dimensional memory structures such as 3D NAND and 3D DRAM, semiconductor devices no longer rely solely on traditional two-dimensional planar structures, but increase memory density by vertically superimposing multiple layers.
In order to fabricate these three-dimensional structures, traditional anisotropic etching (vertical etching) is no longer sufficient, and isotropic etching (horizontal etching) becomes particularly important. Isotropic etching enables uniform etching at finer scales, ensuring precise control of the depth and shape of the pattern at the atomic level, resulting in precise three-dimensional structures.
The 9060 series etching systems are designed for this purpose, with the core benefits of providing greater accuracy and flexibility to help semiconductor manufacturers meet the needs of current and future technologies.
Pictured: Hitachi High-Tech unveils a new etching system
The core benefits of the 9060 series: efficiency, precision and space saving
High-throughput processing saves equipment floor space
When performing isotropic etching in a dry environment, it is often necessary to adsorb free radicals at low temperatures and perform thermal desorption at high temperatures. This process involves heating and cooling and consumes a lot of time and space. To solve this problem, the 9060 series uses an innovative wafer cooling mechanism and infrared heating lamps that enable the wafer to quickly switch between low and high temperatures. This rapid temperature control capability allows the system to efficiently isotropic etch a wide range of materials while reducing the footprint of the equipment.
Compared to traditional etching equipment, the 9060 Series is designed to optimize space utilization, allowing manufacturers to achieve higher productivity in the same production environment, while also reducing operating and maintenance costs.
High-precision isotropic machining
In order to ensure high-precision isotropic etching, the 9060 series relies not only on a fast temperature control system, but also on Hitachi's high-tech plasma etching technology. Plasma etching technology produces plasma by breaking up gas in a vacuum environment, and the surface of the wafer is finely processed through chemical reactions. This technology enables rapid control of the surface reaction rate and precise control of etch depth and shape, especially at the atomic level for fine control of the opening and bottom of the pattern.
This ability to control precision is critical for semiconductor manufacturing, especially for the production of high-density memory devices and integrated circuits. The 9060 Series ensures that every layer of the structure is etched to meet stringent design requirements, ensuring the accuracy and reliability of the three-dimensional structure.
Improve R&D efficiency and reduce production costs
With the ability to provide higher accuracy and higher productivity, the 9060 series helps customers shorten the time from R&D to mass production and reduce manufacturing costs. In semiconductor manufacturing, where the cost and time accumulation of each production step are very important, the 9060 series improves yield and reduces the cost of trial and error in the R&D phase by optimizing the etching process. In particular, when developing complex memory devices such as 3D NAND and 3D DRAM, it can quickly reach mass production standards, providing customers with a great competitive advantage.
Hitachi High-Tech's technological innovation and future prospects
Hitachi High-Tech said that the 9060 series is not only its innovation in the field of plasma etching technology, but also a microcosm of the company's continuous innovation in the field of semiconductor manufacturing. Hitachi High-Tech will continue to meet the growing demand for semiconductor manufacturing through innovative etching technologies and help customers achieve higher product integration and lower manufacturing costs.
As the global semiconductor industry continues to demand smaller, more sophisticated, and more versatile chips, the 9060 series will be an important tool to drive the next generation of semiconductor technology. Hitachi High-Tech plans to continue to invest in R&D to provide digital and intelligent solutions for future semiconductor manufacturing challenges.
