Last month, at the China Mobile Computing Power Network Conference, Zhang Ping'an, Executive Director and CEO of Huawei Cloud, delivered insightful views on the innovation direction of China's chip industry. He pointed out that under the current global chip industry landscape, the direct production of higher-performance chips in mainland China is not smooth. Faced with TSMC's leading position in 3-nanometer and 5-nanometer processes, China's chip industry needs to find innovative breakthroughs. China Semiconductor Network deeply agrees with this, and in this article, we will explore the direction of innovation and development of China's chips in the short, medium, and long term.
Insightful Analysis
Zhang Ping'an's views reveal the realistic challenges and future development directions facing China's chip industry. In the globalized semiconductor industry chain, technological leaders such as TSMC have already occupied a dominant position in the high-end market. For mainland China, directly catching up on process nodes may not seem feasible, but this does not mean that innovation should cease.
Innovations in system architecture become the key direction proposed by Zhang Ping'an. By optimizing system design, existing technologies can be more effectively utilized to enhance overall performance. For example, technologies like heterogeneous computing and high-speed interconnection between chips can significantly increase computational capabilities without solely relying on advancements in chip processes.
Additionally, Zhang Ping'an mentioned the strategy of "trading space, bandwidth, and energy for performance," which essentially refers to optimizing resource allocation and efficient utilization through the construction of computing power networks. This involves various computing resources such as cloud computing, edge computing, as well as support from high-speed networks like 5G and optical fiber communication.
Image: Zhang Ping'an, Executive Director and CEO of Huawei Cloud, discussing the innovation direction of China's chip industry at the China Mobile Computing Power Network Conference
Huawei Kirin Chip: Outstanding Performance in 7-Nanometer Process
"China's chip innovation lies in system architecture capability," and Huawei has been practicing this. Take Huawei's Kirin chip as an example; it is a high-performance processor independently developed by Huawei, primarily using 7-nanometer process technology. Although there is a gap in transistor density and energy efficiency compared to leading-edge 3-nanometer and 5-nanometer processes, Huawei effectively enhances the overall performance through innovative system architecture.
Huawei has adopted various advanced technologies in the Kirin chip, such as CPU multi-core design, integrated GPU, and AI dedicated processing units, significantly enhancing the chip's computational and intelligent processing capabilities. Furthermore, through software and hardware co-optimization, Huawei has improved system operating efficiency and user experience.
Innovations in System Architecture: Huawei's Core Competence
One of Huawei's core competencies in chip design is its innovative system architecture capability. Through carefully designed system architecture, Huawei can fully leverage the chip's performance to achieve efficient data processing and intelligent computing. This system-level optimization enables Huawei's chips to achieve performance comparable to advanced process chips at lower process levels.
Balancing Process and Architecture: Huawei's Strategic Choice
Faced with the complex situation of the international market, Huawei has chosen a path of balanced development between process and architecture. In terms of process, Huawei ensures chip reliability and maturity through 7-nanometer process technology; in terms of architecture, Huawei enhances chip performance and intelligence through innovative design. This strategic choice enables Huawei to maintain competitiveness in global competition.
Conclusion
Huawei's chip strategy provides valuable insights for the development of China's chip industry. Under the constraints of process limitations, through innovation in system architecture and software-hardware co-optimization, Huawei has successfully created the high-performance Kirin chip, demonstrating the innovative strength and development potential of China's chip industry. This practice proves that even with process gaps, breakthroughs in performance can be achieved through innovation and optimization in system architecture, meeting market demands.
Zhang Ping'an's speech provides new ideas for the development of China's chip industry. Faced with the dual pressures of international competition and technological blockade, China's chip industry should not be limited to traditional process catch-up but should build a strong computing power network through innovation in system architecture to enhance overall performance. This not only compensates for process limitations but also positions China favorably in the AI era, driving China's transition from a consumer to a technology powerhouse in chips. Through such innovative paths, China's chip industry is expected to carve out new territory in the global semiconductor industry.
