Since its establishment in 2018, SemiDrive Technology has always focused on the electronic and electrical architecture of "central computing + regional control", and is committed to creating high-performance and high-reliability automotive-grade chips and system solutions, which are widely used in key fields such as intelligent cockpit and intelligent vehicle control. The company has laid out R&D networks in many places across the country, with R&D centers in Beijing, Shanghai, Nanjing, Shenzhen and Dalian, and offices in Changchun and Wuhan to build a complete innovation and service system.
The SemiDrive team is composed of a core technical team with an international vision and rich experience, most of whom have nearly 20 years of complete experience in R&D and mass production of automotive chips, and are one of the few domestic automotive chip companies that can achieve product definition, technical research and large-scale landing.
The strength of vehicle specification certification is leading
In terms of automotive safety and reliability, SemiDrive has made a number of landmark breakthroughs in the industry, and is the first company in China to complete five core safety certifications in the field of automotive chips. Include:
1. ISO 26262 ASIL D functional safety process certification by TÜV Rheinland;
2. AEC-Q100 Grade 1/2 Reliability Qualification;
3. ISO 26262 ASIL B & ASIL D Functional Safety Product Certification;
4. ISO/SAE 21434 Automotive Cyber Security Management System Certification;
5. The State Administration for Industry and Commerce and the State Cryptography Administration issued the national commercial cryptography information security dual certification.
Financing background and market coverage
SemiDrive has completed the B++ round of financing, and its shareholder lineup covers many powerful capitals, including Beijing Yizhuang International Industrial Investment, Jingguorui, SAIC Jinshi, Walden International, Sequoia Capital, Jingwei China, Lenovo Venture Capital and other well-known institutions. At present, its full line of products has achieved stable mass production of more than one million pieces, served more than 260 customers, obtained more than 200 project designations, and reached more than 90% of China's OEMs, and expanded to many international mainstream car companies.
Figure: Part of the honors of SemiDrive Technology
Core Product Matrix
1. Intelligent cockpit chips
X9 series: As a mature product line launched by SemiDrive, the X9 series has been widely used in Dongfeng Honda Lingxi L, FAW Besturn T90 and other models. The new X9SP has further upgraded its computing power, with CPU performance up to 100K DMIPS, GPU processing capacity of 220G FLOPS, and AI computing power of 8 TOPS, which can support multi-screen display and rich interactive experience.
X10 series: A new generation of flagship AI cockpit chips released by SemiDrive at the 2025 Shanghai Auto Show, manufactured using an advanced 4nm process, with NPU performance up to 40 TOPS, bandwidth up to 154 GB/s, and strong graphics processing and AI inference capabilities, and is expected to achieve mass production in 2026.
2. High-performance automotive-grade MCU
E3 series (e.g., E3650, E3620P, etc.): It has successfully filled the gap in the field of local high-end MCUs, and is widely used in core applications such as zone controllers, electric drive systems, power domain control, and assisted driving. E3650 has been designated by a number of leading car companies, and its performance is outstanding.
3. Central gateway chip
G9 "Core of the Network": The gateway product deployed earlier by SemiDrive is specially designed for on-board data transmission and network interconnection, reflecting a high degree of integration capabilities.
4. Intelligent driving chips
V9 "Driving Core": A high-performance platform for intelligent driving, supporting advanced assisted driving functions and providing computing power support for autonomous driving.
Analysis of core benefits
Powerful computing power and stable reliability: For example, the X10 series brings 40 TOPS AI computing power and the E3 series high reliability to ensure stable operation of chips in mission-critical scenarios.
Platform-based architecture design: Software and hardware can be reused, which significantly reduces the development cycle and cost of customers and improves the efficiency of product iteration.
Precise layout for scenarios: The E3 series provides tailor-made solutions for different application scenarios such as zone control, power systems, and autonomous driving, and enhances landing capabilities.
Open Ecosystem Construction and Collaborative Innovation Mechanism: Focusing on the X10 series, SemiDrive has built a diversified AI ecosystem, which is compatible with mainstream open-source large models, and actively promotes win-win ecological cooperation.
Escort of international safety certification: The full range of SemiDrive products have obtained a number of international authoritative certifications, including ISO 26262 ASIL D, to ensure the long-term reliable operation of products under vehicle standards.
Awards & Honors
In recent years, SemiDrive Technology has gained a lot, and has won a number of authoritative awards and market recognitions in the industry, including:
1. 2025 "Zhiding Award" - the most valuable investment of the year;
2. 2025 "Golden Core Award" Outstanding Product Award;
3. 2023 Best Processor Chip of the Year Award (covering CPU/GPU/FPGA);
4. In 2025, it will be listed as a unicorn company in China;
5. In 2024, it will be awarded the "Technology Innovation Award" of Hangsheng Group;
6. In 2023, it won the "Most Valuable Investment Product Award" and "Outstanding Innovative Product Award" in the Automotive Electronics Technology Awards;
7. In 2024, it won the "Information Technology Industry Grand Prize" and the "First Prize in the Enterprise Group".