Recently, Malaysian Prime Minister Anwar Ibrahim announced that Malaysia's semiconductor industry investment target is at least 500 billion ringgit (about 107 billion US dollars). This huge investment aims to enhance Malaysia's position in the global semiconductor industry and propel it towards its goal of becoming a global manufacturing hub.
Malaysia has previously pushed for a new Industrial Master Plan (NIMP) 2030 aimed at developing front-end manufacturing capabilities. The investment target is to focus on high-end manufacturing fields such as integrated circuit design and advanced packaging, aiming to realize the transformation and upgrading of the industrial structure and enhance the overall value of the industrial chain.
As a significant player in the global semiconductor test and packaging market, Malaysia has captured 13% of the market share. In recent years, the country has managed to attract billions of dollars in investment from global semiconductor giants, including Intel and Infineon. Anwar said the new investment plan will focus on areas such as integrated circuit design, advanced packaging and semiconductor chip manufacturing equipment.
The investment will be primarily used in several areas of the semiconductor industry, including integrated circuit design, advanced packaging, and semiconductor chip manufacturing equipment. These areas are the core components of the semiconductor industry and are of great significance in enhancing Malaysia's competitiveness in the global semiconductor industry.
Figure: Malaysia has invested 100 billion yuan in semiconductors
In addition, Malaysia plans to nurture at least 10 local companies in the field of semiconductor chip design and advanced packaging. These companies are expected to have annual revenues of between US$210 million and US$1 billion, breathing new life into Malaysia's semiconductor industry. To achieve these goals, the Government of Malaysia will provide US$5.3 billion in financial support. These funds will be used to support the development of local companies and promote innovation and upgrading in the semiconductor industry.
The Malaysian government has offered incentives including tax breaks, subsidies and visa fee waivers to attract international tech companies and investors. In addition, Malaysia plans to train and upgrade the skills of local highly skilled engineers, with the goal of developing and expanding a team of 60,000 professionals. These measures will help to enhance Malaysia's attractiveness in the semiconductor industry and attract more foreign investment and talent into the field.
Malaysia also plans to build Southeast Asia's largest integrated circuit design park and offers incentives including tax breaks, subsidies and visa waivers to attract global tech companies and investors. These measures will help to increase Malaysia's attractiveness in the semiconductor industry and attract more foreign investment into the sector.
Malaysia is a significant player in the global semiconductor test and packaging market, accounting for 13% of the market share. With this investment plan, Malaysia will further strengthen its position in the global semiconductor industry and is expected to achieve even greater growth in the future.
