As chipmakers accelerate the expansion of AI, 5G and advanced process nodes, TECHCET's latest report predicts that the global e-gas market will grow by 4.8% year-on-year to $6.34 billion in 2025. Among them, the specialty gases market is expected to grow by 5.2%, while bulk gases are expected to grow by 3.8%. This growth trend is highly consistent with the semiconductor industry's expectation of revenue exceeding $705 billion, according to TECHCET's 2025-26 Electronic Gas Critical Materials Report.
Electronic gases refer to special gases used in the production of electronic products such as semiconductors, flat panel displays, light-emitting diodes, and solar cells. They are indispensable basic materials in the production of the electronics industry, and are widely used in thin films, etching, doping, vapor deposition, diffusion and other processes. Because its purity and impurity content directly affect chip performance and yield, it is known as the "blood" of the semiconductor industry. Electronic gases play an extremely important role in semiconductor manufacturing, running through almost every step of the process, from chip growth to final device packaging.
The central role of electronic gases in the field of semiconductors
Penetration of the whole process of chip manufacturing
Wafer preparation: Polysilicon is prepared by chemical vapor deposition (CVD) of high-purity silane (SiH₄), and then the wafer substrate is obtained by single crystal growth.
Lithography & Etching:
Etching gases (e.g., CF₄) react with the plasma to transfer the photoresist pattern to the wafer material (e.g., silicon, metal layers) to form nanoscale circuit structures.
Example: In the 7nm process, atomic layer etching (ALE) technology needs to precisely control the pulse dose of fluorine-based gases to avoid device failure due to excessive etching.
Thin Film Deposition:
Dielectric layer (e.g., SiO₂, SiN): Silane reacts with oxygen to form silica, which acts as a device isolation layer;
Metal layers (e.g., Cu, Al): Trimethyl aluminum (TMA) reacts with hydrogen to deposit an aluminum film that is used to interconnect wires.
Ion implantation: Doped gases (such as phosphine) are ionized to form an ion beam, which is injected into the surface layer of the wafer to control the regional conductivity.
Packaging & Detection: Helium is used for leak detection after chip packaging (helium mass spectrometry leak detection) to ensure that the device is hermetically sealed.
Figure: TECHCET: The global e-gas market will grow by 4.8% year-on-year in 2025
A key factor in determining chip performance and yield
Extremely high purity requirements: Electronic gases typically need to be more than 99.999% (5N) pure, and impurities (e.g., moisture, metal particles) can cause short circuits or device failure. For example, water vapor levels above 1ppm can cause corrosion of the aluminum interconnect, affecting chip reliability.
Narrow process window: Small fluctuations in gas flow, pressure, and temperature can significantly affect film uniformity or etching accuracy. Example: In mask cleaning for extreme ultraviolet (EUV) lithography, the concentration of fluorine-based gases needs to be precisely controlled in the ppb range, otherwise the nanoscale pattern may be damaged.
Support advanced processes and special processes
Advanced processes (e.g., below 3nm): Atomic layer etching (ALE) with high-purity nitrogen trifluoride (NF₃) is required to achieve atomic-level material removal;
Third-generation semiconductors (e.g., SiC, GaN): hydrogen (H₂) for silicon carbide (SiC) epitaxial growth, chlorine (Cl₂) for dry etching of gallium nitride (GaN) devices;
MEMS (Microelectromechanical Systems): Deep Reactive Ion Etching (DRIE) technology of sulfur hexafluoride (SF₆) enables the fabrication of micron-scale cantilever beams and sensor structures.
"With the popularity of extreme ultraviolet lithography (EUV) technology, the development of advanced packaging processes, and the proliferation of AI-centric devices, the demand for ultra-high purity gases and complex gas mixtures is rapidly increasing," said Lita Shon-Roy, President and CEO of TECHCET. These materials are indispensable in key processes such as advanced etching, deposition, and cavity cleaning.”
Geopolitics and localization trends are key factors in the market, where risks and opportunities coexist. The trade friction and tariff policy between the United States and China have promoted the localization of supply chains and the return of industries. Despite this, some Asian fabs operating in the U.S. continue to source specialty gases from Asia to ensure consistency in their production processes. Suppliers are responding to market changes through regional expansion, while Chinese and Korean start-ups are looking for ways to go global.
Overall, the e-gas market is ushering in a steady and sustained growth phase driven by technology and the reshaping of the global supply chain.
