Terecircuits is a startup in advanced materials for the semiconductor industry. Terecircuits, Inc. today announced the launch of a new patented material called Terefilm, which is designed for temporary bonding and debonding applications in advanced packaging. This material is able to meet the needs of today's emerging applications such as thin wafer handling and the transfer of fragile components as components become smaller and more complex in procedures and processes.
"The next generation of industry leaders will be those that recognize the ability to design and integrate complex SoC solutions with concepts such as advanced packaging," said the Boston Consulting Group. "According to the market research report, the global advanced packaging market is experiencing rapid growth and is expected to grow at a CAGR of 7.65% between 2021 and 2029, with a market size of more than $61.69 billion by 2029. The major drivers for this growth include the increasing complexity of semiconductor integrated circuit (IC) designs and the increasing number of functions and features integrated in consumer electronic devices. As one of the world's largest markets for semiconductor packaging materials, China's market size reached RMB 46.3 billion in 2022 and is expected to continue to grow rapidly. The growth of the Chinese market is driven by the rapid development of 5G technology, with more than 1.425 million 5G base stations currently installed, supporting more than 500 million 5G users, which is further increasing the demand for semiconductor packaging. In terms of packaging technology, 3D stacked packaging and embedded substrate packaging (ED) are fast-growing areas. The market size of 3D stacked packaging was valued at USD 3,833 million in 2022 and is expected to grow to USD 7,367 million by 2026, growing at a CAGR of 18% from 2022 to 2026. The market size for ED packaging was valued at USD 78 million in 2022 and is expected to grow to USD 189 million by 2026, growing at a CAGR of 25% from 2022 to 2026.
Figure: Terecircuit introduces wafer bonding materials for next-generation advanced packaging
It is reported that this new patented material has great advantages, such as fast release, precise patterning, and clean decomposition without solvents. And the material can be used in processing up to 230°C, providing customers with a wide range of bonding-debonding processes as well as clean decomposition. Terecircuits chief executive officer Wayne Rickard said Terefilm's R&D focus is on creating a novel material to enable faster and more precise semiconductor advanced packaging and related manufacturing processes. Terefilm's strengths in bonding and debonding for semiconductor advanced packaging are clear, providing ultra-clean, ultra-fast, and residue-free releases, eliminating the need for traditional cleaning and accelerating production. At the same time, it enables selective material removal at the nanoscale, allowing it to be used in a variety of applications, such as parallel transfer of microLEDs and photoresists written directly to lithography. This flexibility makes Terefilm a valuable solution for today's advanced packaging challenges as well as tomorrow's electronics manufacturing needs.
According to the official website of Terecircuits, Terefilm has the following features:
Clean decomposition: Unlike traditional materials, Terefilm undergoes a very clean decomposition process when activated, leaving no residue. This ensures an ultra-clean surface, which is essential for successful hybrid bonding and other high-precision applications.
Rapid release: Traditional heat- and UV-sensitive films can take a few minutes to release. However, Terefilm is released in microseconds. This near-instant decomposition significantly improves manufacturing efficiency.
Precise patterning: Similar to photoresists, the material can be patterned to select specific areas. This allows for the targeted release of individual chips or subsets of chips, replacing the traditional pick-and-place process. This capability allows multiple components to be transferred in parallel, dramatically increasing production speed and accuracy.
