With the rapid growth of demand for AI chips, the market demand for advanced packaging technology continues to rise. Previously, TSMC Chairman Wei Zhejia has confirmed that the company is working on a small production line of fan-out panel level packaging (FOPLP) technology, which is expected to achieve results within three years, marking TSMC's new progress in the field of high-end packaging.
TSMC chooses a 300x300mm substrate size
According to the latest report from Taiwanese media MoneyDJ, TSMC has set preliminary specifications for the substrate size of FOPLP technology, and decided to use a size of 300x300mm instead of the previously rumored 515x510mm. TSMC's equipment suppliers are working closely together to develop this technology, and it is expected to launch a micro production line as early as 2026, with plans to gradually expand production capacity by 2027.
TSMC initially considered a larger 515x510mm rectangular substrate, but decided on a 300x300mm substrate after considering the "cost of ownership" (COO) and the maximum reticle size it could support. This decision was based on several factors: Larger substrates not only exacerbate warpage issues, but can also increase the risk of damage during shipping and create additional challenges for packaging process changeovers. Therefore, TSMC decided to start with the 300x300mm size first, and then consider expanding the substrate size as the technology progresses.
Figure: TSMC Advances FOPLP Packaging Technology: Small-Scale Production Line Expected Within Three Years (Source: TrendForce).
Market demand for FOPLP technology
FOPLP (Fan-Out Panel Level Packaging) technology is an important packaging solution launched by TSMC in recent years. Back in 2016, TSMC introduced Integrated Fan-Out (InFO) technology, an innovative form of FOWLP (Fan-Out Wafer-Level Packaging). The first batch of applications of this technology is the iPhone 7 A10 processor, with its high efficiency, low-cost characteristics, FOPLP has been favored by more customers, especially after the demand for high-performance applications such as AI chips has increased significantly, the market prospect of FOPLP technology is becoming more and more broad.
With the surge in demand for AI chips, the demand for advanced packaging capacity in the global semiconductor industry continues to grow. As a cost-effective advanced packaging solution, FOPLP is becoming an ideal choice for AI chips and other high-performance computing devices, which is why TSMC has increased its investment in this area.
The layout of other semiconductor giants
In addition to TSMC, other semiconductor giants around the world are also actively promoting the research and development and application of advanced packaging technology. Samsung currently offers a variety of advanced packaging technologies, including I-Cube 2.5D, X-Cube 3D IC and 2D FOPKG, especially for low-power memory integration, and has launched Fan-Out Panel Level Packaging (FOPLP) and Fan-Out Wafer-Level Packaging (FOWLP) platforms for mobile phones and wearables.
Intel plans to launch the industry's first glass-based solution for next-generation advanced packaging, with mass production expected between 2026 and 2030. With the continuous advancement of manufacturing processes and packaging technology, Intel's glass substrate technology is expected to provide more reliable and efficient packaging solutions for future high-performance chips.
Conclusion
Driven by strong demand in AI chips, 5G, automotive electronics and other fields, advanced packaging technology is becoming an important development direction for the semiconductor industry. The continuous innovation of TSMC, Samsung, Intel and other companies in this field will bring new technological breakthroughs and market opportunities to the global semiconductor industry. With the continuous maturity of FOPLP, FOWLP and other technologies, we can expect more efficient and intelligent packaging solutions to be widely used in the next few years, providing strong technical support for various end products.
