Beijing, December 5, 2024 – X-FAB, the world's leading analog/mixed-signal foundry, announced the launch of an innovative embedded data storage solution on its 110nm BCD-on-SOI technology platform. The solution combines flash memory and EEPROM components to provide enhanced data retention and best-in-class operational reliability using x-fab's SONOS technology.
The solution meets the AECQ100 Grade-0 standard and offers 32kByte of embedded flash IP with 4Kbit EEPROM. X-FAB plans to roll out 64KByte and 128KByte flash memory as well as larger capacity EEPROM starting in 2025.
Figure: X-FAB introduces an embedded data storage solution based on its 110nm automotive BCD-on-SOI technology
By clever design, the flash and EEPROM components are integrated into a single macro unit, sharing control circuitry, simplifying layout, reducing the overall footprint, and setting a new industry benchmark for 32KBytes memory solutions. The solution is capable of reading data from -40°C to 175°C, and EEPROM can also write data at temperatures up to 175°C, making it suitable for automotive, medical, and industrial applications.
The embedded flash memory provides advanced data access capabilities, and the EEPROM increases the durability and flexibility of the flash memory by programming data to the EEPROM under operating conditions that are not suitable for writing to the flash memory, and then writing to the flash memory when the temperature drops below 125°C. In addition, the solution uses a 64-bit bus with 8-bit ECC for the flash memory components and 14-bit ECC for the EEPROM components to achieve zero PPM error performance.
Thomas Ramsch, Director of NVM Development at X-FAB, said: "This new NVM IP combines our SONOS technology to deliver the highest level of reliability. By combining flash and EEPROM, we create embedded data storage solutions that can handle the harshest working environments.”
Nando Basile, Technical Marketing Manager, NVM Solutions at X-FAB, added: "Our NVM portfolio IP will play a key role in the development of high logic density applications, enabling a wider range of capabilities for next-generation smart sensor and actuator CPU system designs.”
X-FAB is a global foundry group with exceptional expertise in analog/mixed-signal technologies, microsystems/MEMS and silicon carbide (SiC) serving end markets such as automotive, industrial and medical. For more information, please visit the official X-FAB website.
About X-FAB: X-FAB is the world's leading foundry group, providing comprehensive expertise and design IP to help customers develop world-leading semiconductor products. Since April 2017, X-FAB has been listed on Euronext Paris and currently employs around 4,500 people. For more information, please visit www.xfab.com.
