Semiconductor equipment manufacturer YES Corporation announced that it has entered into a partnership with SkyWater Technology, which has selected YES' innovative RapidCure polymer curing system to accelerate the production of its M-Series fan-out wafer-level packaging technology. This collaboration marks a major breakthrough in semiconductor packaging technology, meaning chipmakers are able to complete more efficient packaging processes in less time.
Fan-out wafer-level packaging is an advanced semiconductor packaging technology that integrates multiple chips in a smaller, more compact package, and is widely used in high-tech fields such as smartphones, automobiles, and medical devices. As chip design becomes more and more complex, traditional packaging methods can no longer meet the needs of high performance and low cost, so the rise of FOWLP technology is considered to be an important development direction of packaging technology in the future.
Advantages of RapidCure technology:
YES's RapidCure system, which combines ultraviolet (UV) pretreatment with a precise thermal curing process, significantly reduces curing time. The traditional polymer curing process usually takes several hours, but with RapidCure technology, this process can be completed in less than 20 minutes, which is more than 10 times faster than traditional methods! This extremely fast curing greatly increases production efficiency and reduces overall production costs.
The application of RapidCure technology, especially in low-temperature polymer curing, is due to the fact that in semiconductor packaging, the size of the material is becoming smaller and the process requirements are becoming more stringent, and traditional curing methods can no longer meet the demand. Especially in high-precision packaging such as FOWLP, reducing curing time, temperature and energy consumption is key to increasing production efficiency.
Pictured: YES company has partnered with SkyWater to introduce revolutionary semiconductor packaging technology
Background:
SkyWater Technology has partnered with Deca Technologies to support the "reshoring" of the semiconductor supply chain – bringing some of its production back to the U.S. – using the M-Series packaging technology developed by Deca – which is critical to the safety and efficiency of the global semiconductor value chain. SkyWater became the first company to license the M-Series packaging technology and the first to apply the technology in the United States.
Bassel Haddad, Senior Vice President and General Manager of SkyWater, said, "We are excited to be our first customer of YES RapidCure technology. With this technology, we are able to shorten the curing process time and provide faster prototyping services, while improving reliability and productivity to meet our customers' needs for fast delivery."
Behind the technological innovation:
Tim Olson, founder of Deca Technologies, the birthplace of RapidCure technology, said: "RapidCure technology was born out of our goal to revolutionize semiconductor packaging technology. Its fast-curing capability will revolutionize the way high-density heterogeneous integration technologies are produced, especially in core designs, which can effectively improve the speed of product development and production flexibility.”
This technological breakthrough is not only of great significance to SkyWater and YES, but also brings new hope to the entire semiconductor industry. With the increasing requirements for miniaturization, low power consumption and high performance of high-tech products, the innovation of semiconductor packaging technology is becoming more and more important.
Summary:
YES' RapidCure technology not only accelerates the semiconductor packaging process, but also enables chipmakers to respond more quickly and flexibly to market demands. With the deepening of the cooperation between SkyWater and Deca Technologies, more semiconductor companies will benefit from it in the future and promote the further development of the global semiconductor industry chain. RapidCure technology is undoubtedly the key to the future of semiconductor packaging, enabling the next generation of smart hardware products to be launched faster.
