Yield Engineering Systems (YES) today announced the launch of the VertaCure XP G3 curing system for use in the production phase. The system will be used in advanced AI and high-performance computing (HPC) semiconductor packaging manufacturing, specifically in the process of cryogenic curing of multiple redistribution layers (RDLs) in 2.5D/3D packages. The VertaCure XP G3 can also be optimized to support high-throughput hybrid bonding annealing solutions. YES has long been known for its superior performance and stability in the areas of curing, coating and annealing, both in R&D and in large-scale production. With the rapid development of AI and HPC applications, the requirements for semiconductor packaging are getting higher and higher. In particular, in the areas of 3D packaging, wafer-level packaging (WLP) and high-performance interconnect technologies, the introduction of the VertaCure XP G3 is a key step in addressing this trend.
The latest addition to the VertaCure family is the VertaCure XP G3, a fully automated, 6-zone vacuum curing system that completely removes residual solvents, ensures uniform temperature distribution, and precisely controls heating and cooling rates. One of its biggest advantages is that there are no gas emissions after curing and it has excellent particle properties. At operating temperatures greater than 200°C, VertaCure XP G3 can provide thermal uniformity of ±1°C, which is critical for the curing of thick-film polyimides (PIs). Due to the rise of AI chips, 5G, autonomous driving, edge computing, and other fields, the demand for high-performance and high-reliability packaging is rising. VertaCure XP G3 provides the necessary technical support for these areas, especially breakthroughs in low-temperature and thick film curing.
Figure: VertaCure XP G3 Curing System Released: Driving New Breakthroughs in AI and HPC Packaging Technology (Source: YES)
Saket Chatdada, senior vice president of ES, said, "The VertaCure system is a production-proven, automated vacuum curing equipment that delivers superior film performance and higher productivity than conventional atmospheric curing. It is equipped with a 6-zone temperature control system and laminar flow technology to guarantee the uniformity and particle properties required for the curing of polyimide (PI), polybenzoxazole (PBO) and epoxy resins. In addition, it provides excellent mechanical, thermal, and electrical properties for a wide range of polymers in wafer-level packaging (WLP), which are critical for AI and HPC-related applications. " VertaCure XP G3 not only improves productivity, but also offers significant benefits in terms of lower total cost of ownership (CoO). Through optimized processes, it helps manufacturers reduce raw material waste and energy consumption, while improving production reliability and repeatability, and reducing the risk of process instability.
According to Alex Chow, President and Senior Vice President, Business Development & Marketing, YES Asia, "The VertaCure family of products provides a controlled, repeatable and scalable manufacturing process for wafer-to-wafer and die-to-wafer bonding and polymer curing applications. The system delivers superior quality and total cost of ownership (CoO) when manufacturing advanced packaging solutions, especially in applications in the semiconductor industry. With the launch of the VertaCure family of products, we further strengthen our leadership position in the curing tools market. ”
The introduction of the VertaCure XP G3 system not only provides semiconductor manufacturers with more efficient and accurate production tools, but also helps drive the continued development of advanced packaging technologies in the context of growing demand for AI, HPC, and other high-end packaging. Through its innovative design and superior performance, this device will help the semiconductor industry meet increasingly complex technical challenges and provide more efficient manufacturing solutions.
